8-layer PCB with Blind/Buried VIAs->circuit board

Join

Help

Shenzhen Sun&Lynn Circuits Co., Ltd

Home

	Recommended Results

8-layer PCB with Blind/Buried VIAs

Category :

Electronic and electrical->circuit board

Product Specification

Model No:	S1001283223

Brand	SL
Materials	FR4
Color	Red
Packing	Vacuum packing
Minimum Order	No requirement

Product Detail

8-layer PCB
8-layer PCB with Blind/Buried VIAs, Unsymmetrical Laminated Stackup Technique
Key Specifications/Special Features:

Red color LPI solder mask
Minimum blind/buried VIAs hole size: 10 mil
Board thickness: 40mil
Surface finish: immersion gold
PTH hole diameter tolerance: 3mil
NPTH hole diameter tolerance: 2mil
Hole position deviation: 2mil
Outline tolerance: 4mil
Minimum S/M pitch: 4mil
Twist and bent <=1.0%
Peel-off strength: 1.4N/mm
Solder mask abrasion:>6H
Flammability: 94V-O
E-test voltage: 50V to 300V

Product Certifications:
Certificate Standard:Lead Free
Certificate Number:SZTYR050204857/LP
Certification Agent: SGS
Certificate Standard:UL
Certificate Number:E234156
Certification Agent: UL

More Products from this Supplier

12pcs Per Step Thin PCB

Blue Color Solder Mask 4-Layer PCB


[ Back Products Catalog ]

Commerce Member:
Please log in your ID and password, we will later fill in relating info.

ID:

Password:

Remember my ID on this computer


	Complete this form below to send out your enquiries. All enquiries will be automatically sent to the company you want to develop.

	Subject
	Content	(Don't input Company Name, E-Mail, Phone Number, Fax Number, and URL)

Company Profile:

* Company Name

*E-mail

*Country

*Contact Person

URL

*Phone

- -

Fax

- -

*Postal code

*City

*Street Address

*Business Nature

Distributor Exporter Importer Manufacturer
Whole Sale Retailer Reseller Retrofitter User
Others, please specify:

*Security Code


Enter the security code.